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Apple Mac in late 2020 – What’s new and what’s left

Apple Mac in late 2020 – What’s new and what’s left

You might be confused if you visit the Apple Store online in the near future looking for a MacBook. Several products were revealed here in late 2020 with Apple's first chipset made for MacOS. It's important that we know which new Mac products have said M1 chip, and which are otherwise running previous-generation silicon.

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M1 MacBook Pro (late 2020) release date and price

M1 MacBook Pro (late 2020) release date and price

The first MacBook Pro with Apple silicon inside is the MacBook Pro (late 2020) 13-inch. This device is one of three in the first run of M1 devices from Apple. These devices are able to run MacOS app and iOS (and iPadOS) apps and has significantly more processing power than previous-model MacBook Pro machines.

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MacBook Air with M1 gives Apple Silicon its first Mac

MacBook Air with M1 gives Apple Silicon its first Mac

The new MacBook Air (late 2020) was revealed today with an Apple M1 chip and a 13-inch display. This newest MacBook works with two USB-C ports on its left side and no fan inside. This device is the first with Apple's new M1 chip, SSD (with far faster speeds than previous models), and up to 2x more battery time than the previous model.

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Apple M1 chip revealed – First Apple Silicon for Mac

Apple M1 chip revealed – First Apple Silicon for Mac

Today the Apple M1 chip was revealed as the first Apple Silicon for Mac. This desktop chip will work with unified memory architecture, an integrated GPU, and its own neural engine. Apple described this architecture as "the first personal computing chip built using industry-leading 5nm technology." This chip will be part of the larger Apple Silicon collection, running multiple sorts of devices in the next few years.

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Apple Event today: Our most far-fetched expectations

Apple Event today: Our most far-fetched expectations

This morning we're looking at what to expect from Apple's One More Thing event later today. The Apple Silicon Macs are almost certainly set to be the main attraction today, complete with ever-so-slight redesigns of hardware and big changes to the capabilities of the software and processing therein. But what else might Apple show? What other products might've been hidden so exceedingly well by Apple that we've barely seen them reported as leaks in the recent past?

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Sony’s hot feature for 2019 phones: ToF 3D

Sony’s hot feature for 2019 phones: ToF 3D

Sony 3D camera modules were given a boost in manufacturing output in Asia after a recent burst in interest from smartphone brands. Brands like Apple and Samsung will feature the Sony 3D camera module in some form or another, so says sources inside the industry that wish to remain anonymous. Sony sensor division's head Satoshi Yoshihara suggested that Sony chips will power 3D cameras from several smartphone brands in 2019.

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Qualcomm’s next-gen 7nm Snapdragon is in the hands of phone-makers

Qualcomm’s next-gen 7nm Snapdragon is in the hands of phone-makers

Qualcomm will shift to a new 7nm system-on-chip design for its next, 5G-capable flagship mobile platform, though the company isn't quite ready to spill the beans completely on what it has planned. The new SoC - which Qualcomm says it expects to be the first 5G-capable mobile platform for premium-tier smartphones and more - is currently sampling to device partners.

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Behold, 3D color X-rays: MARS scanner, made with CERN tech

Behold, 3D color X-rays: MARS scanner, made with CERN tech

This week the folks at MARS Bioimaging revealed the first 3D color X-Ray of the insides of a human body. They've got a device called the MARS large bore spectral scanner, AKA the MARS spectral x-ray scanner - and we're crossing our fingers for a simpler name as the product is further developed, too. This scanner uses an adaptation of technology first used by CERN in the hunt for the God particle.

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Samsung won’t rest until it’s inside every phone (iPhone included)

Samsung won’t rest until it’s inside every phone (iPhone included)

It looks like Samsung is about to be inside your favorite smartphone once again. While the company's chip-making devision lost their contract deal with Apple several years ago, they plan on picking up the pace once again the very near future. They began their series of big moves toward the future they envision earlier this year by splitting off their chip-making business arm within their semiconductor division as "Samsung Foundry" - and it would appear that their next goal is the iPhone.

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EMV Chip and PIN just suffered another huge setback in the US

EMV Chip and PIN just suffered another huge setback in the US

An announcement from VISA suggested that Chip and PIN technology in fuel pumps will be delayed for several years. The original U.S. Automatic Fuel Dispenser EMV activation date for VISA for gas stations throughout the United States was set for October 1, 2017. That date has now been pushed to October 1, 2020.

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Qualcomm outs Snapdragon Wear 1100 for target-purpose wearables

Qualcomm outs Snapdragon Wear 1100 for target-purpose wearables

When smartwatches arrived on the scene almost two years ago, there were still no components specially designed to the still unheard of device. That meant manufacturers had to make do retrofitting smartphone pieces for smartwatches, which practically meant using unoptimized hardware. February this year, Qualcomm unveiled the Snapdragon Wear 2100 to offer a system-on-chip solution more suited for smartwatches and similar multi-purpose devices. Now at Computex 2016, it is following that up with the Snapdragon Wear 1100 which targets more special-purpose devices instead.

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NXP QorIQ LS1012A 64-bit ARM processor is smaller than a thumbtack

NXP QorIQ LS1012A 64-bit ARM processor is smaller than a thumbtack

NXP Semiconductors has rolled out the QorIQ LS1012A processor promising enterprise-class performance and security for consumer and networking applications in a very small package size. The chip has a 64-bit ARM v8 processor with network packet acceleration and QorIQ trust architecture security capability and line-rate networking performance at 1W of power. The chip packs all its features into a tiny 9.6mm x 9.6mm package size.

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