TP-Link has trotted out some new smartphones that slot into the Neffos line at IFA 2016 in Berlin. The smartphones aim for a premium design with metal unibody exteriors that are designed to look as if they were smoothed over time by water in a stream. The dual-curved back design tapers towards the sides for an ergonomic fit in the hand. The tapered design also means these are some of the narrowest devices in the smartphone realm with the X1 Max having sides 2.75mm thick and the X1 being slightly thicker at 2.95mm.
Despite the thin profiles of the smartphones, they each have a side mute button. Both of these smartphones also have thin bezels at 0.6mm with chamfered edges. The screen to body ratio is 76% . Both smartphones use in-cell technology with touch and display driver integration and are covered by 2.5D Gorilla Glass in the case of the X1 Max. The screen on the max is 5.5-ninches with 1000:1 contrast.
The screen on the standard X1 is 5-inches and has 1280 x 720 resolution. The X1 has a Helio P10 octacore chip at 1.8GHz and can be had with 2GB of RAM and 16GB storage or 3GB of RAM and 32GB of storage. A memory card slot is available for expansion and the X1 has a 5MP front camera and 13MP rear camera.
The X1 Max uses a Helio P10 processor at 2 GHz and comes in versions with 3GB of RAM and 32GB of RAM and 4GB of RAM with 64GB of ROM. A microSD card slot is integrated and it has the same front and rear cameras the X1 offers. Power for the X1 Max is from a 3000mAh battery with the X1 using a 2250 mAh battery. The X1 will sell for €199 and the X1 Max sells for €249 with launch set for Q4 2016.