Current reports indicate that Apple will move to a larger screen on the next iPhone, bringing with it an increase in resolution. Now the Wall Street Journal reports that Apple is planning to use a new type of touchscreen that’s thinner than current technologies. Sharp, Japan Display, and LG are all said to be producing in-cell touch panels for the next iPhone, according to sources familiar with the matter.
In-cell technology integrates the touch sensors directly into the LCD, negating the need for an additional touch layer which adds thickness to the screen. The difference is only around 0.5mm, but the removal of that layer will also result in improved screen quality. In addition, the Wall Street Journal says that Apple’s supply chain would be simplified, and that the company would ultimately cut costs as a result of the move.
That space could allow for the device to be slightly thinner, or give Apple extra space for additional components. The use of an even smaller SIM card would also give Apple more room to play with, and European carriers are reportedly stocking up on the nano-SIM that was recently approved. The going theory is that Apple will use the new standard in the next iPhone, with the nano-SIM being 40% smaller than current micro-SIMs. The crucial piece of information to take away is that Apple reportedly designed the next iPhone around the new nano-SIM, which puts the standard war with RIM, Motorola, and Nokia into a whole new perspective.
The next iPhone is said to have 3.95-inch screen with a 1136×640 resolution, a move to an aspect ratio close to 16:9. Leaked backplates show that the handset will feature a two tone aluminium back, as well as a new 19-pin dock connector and what look to be machine drilled speaker and microphone holes. The core apps of iOS6 will take advantage of the new resolution, and Apple will reportedly encourage developers to redesign their own apps to do the same.