More HTC Bolt details ahead of unveiling this week

It's no secret that HTC hasn't exactly been doing well in the smartphone market. In fact, one might even wonder if HTC is better off just putting its eggs in the Vive VR basket instead. It might have had a bit of financial reprieve by becoming the Google Pixel's manufacturer and assembler, but it has yet to stand on its own smartphone feet. That chance might come with the HTC Bolt, which could be announced this week. And based on this latest leak, it might be a rather high-end smartphone, but an odd one at that.

Despite the changes that HTC has made with the HTC 10, its champion smartphone barely made a dent in the market. It is actually typical of HTC's smartphones which are usually received warmly by reviews but don't do well in the market. It does seem that, at least this year, HTC is a bit distracted with the Vive VR headset's launch as well as the Google Pixel. Perhaps it's time for it to return to its roots.

Leaked slides give a glimpse of what the smartphone will be like. Internally at least. Its spec sheet includes a 5.5-inch screen with a QHD resolution, a surprising detail given how slow HTC was to adopt high resolutions. The 3,200 mAh battery might be a bit disappointing, but HTC will make up for it with fast charging. The 16-megapixel f/2.0 camera is noted to have OIS capability. And the smartphone itself will boast of IP57 dust and water resistance, unlike that smartphone that HTC made for Google.

The odd part comes from the Qualcomm Snapdragon 810 that will allegedly run inside. Not exactly the highlight of Qualcomm's chips. There will also be no headphone jack, according to earlier leaks. And yet the smartphone will be paired with "adaptive" headphones, at least with some distributors and carriers.

According to the slides, the HTC Bolt is scheduled to be announced Friday, November 11, though availability details are still up in the air. Sadly, if those same documents are correct, the smartphone will be exclusive to only one carrier in the US.

VIA: TechnoBuffalo