All many of us really expect to see at MWC are new handsets, handset tech, and software. I didn’t expect to see a new version of the Bug modular platform at the show. Bug Labs has unveiled its Bug 2.0 platform with support for Android and OMAP 3 from TI.
The new platform is based on the TI OMAP 3 platform and supports BeagleBoard with the capability to run all apps written for the device. The new platform can take advantage of the collection of BUGmodules that are available.
The Bug 2.0 platform allows users and companies to conceptualize, prototype, and test wireless devices. The platform and hardware of the Bug 2.0 platform can be used to create new Android applications. Pricing and availability are unknown at this time.