Two of the biggest companies in memory technology — Kingston and Rambus — have announced that they have teamed up to develop a new threaded module prototype using DDR3 RAM for multi-core computing. The two firms report that initial testing shows significant improvement in performance.
Rambus claims that testing so far with initial silicon has shown a performance improvement in data throughput of up to 50% while reducing power consumption by 20% compared to normal memory modules. The prototype device is an effort by the two firms to address the need for throughput-intensive computing in computers.
The threaded module tech in the prototype device uses industry standard DDR3 devices and a conventional module infrastructure. The improvement in power efficiency is achieved by partitioning the modules into separate independent channels that share common command/address port. Rambus will show the prototype off at IDF later this month.