Video demo after the cut

Moorestown, as we know, is Intel’s next-gen range of Atom Z6xx processors designed for frugal devices like smartphones, slates and other ultra-mobile PCs.  Carrypad says the N-Pad is both thin and very light, similar to what we’ve grown to expect from ARM-based slates, and that it’s previously been shown running MeeGo.  Obviously that’s Intel’s current pet-OS, so if the N-Pad does arrive on the market we wouldn’t be surprised to see it running rather than the Google platform.

If cores, that could fit in with Intel’s previous moves to make significantly power-reactive SoCs that can better scale according to the tasks they’re faced with.  While it might seem strange for a smartphone chip – such as the Z series – to have more cores than the N series, Intel’s power management technology would allow it to selectively turn off unneeded cores in a more granular way, thus making for a more frugal SoC.

Of course, there’s a big difference between putting together a slick slide and actually manufacturing chips, and it’s telling that Intel has avoided putting any sort of definitive timescale onto their chart.

[via CNET]

Many of them – the AAVA phone included – run the Atom Z6xx series processor, formerly known as Moorestown.  As ever, Intel were keen to point out the CPU’s much-reduced thermal output and idle power consumption compared to previous-gen Atoms: more than 50x less idle power, 20x less audio power, and 2-3x reductions in browsing and video playback power consumption.

Others use Oak Trail based CPUs, basically Moorestown with Windows support, such as the gaming handheld; that actually runs Windows 7, despite the small size.  As for when we might see commercial products using the various chips, Intel says it’s on-track with its smartphone plans.

An FPGA is a programmable logic chip that allows for greater flexibility by system designers to add non-standard I/O or acceleration.  Intel says this will allow manufacturers more options in their products, together with greater differentiation, without necessarily losing out on the speed-to-market that Stellarton offers.

Press Release:

Intel Opens Software App Store, Offers New Intel Atom Chips

SAN FRANCISCO – (Business Wire) During keynote presentations today at the Intel Developer Forum, Intel Corporation executives outlined several software- and hardware-related efforts as the company intensifies its System-on-a-Chip (SoC) product plans based on the Intel® Atom™ processor family.

Amid predictions of billions of additional Internet-connected devices going online, Renée James, senior vice president and general manager, Intel Software and Services Group, and Doug Davis, vice president and general manager, Embedded and Communications Group, discussed the expansion of these processors into high-growth areas including netbooks, tablets, CE, embedded, and smart phones.

James: The Best Experiences Are Created on Intel Architecture

During her keynote at Moscone Center West in San Francisco, James outlined how tightly integrated and optimized software and platforms will deliver new levels of performance, along with fresh capabilities and the importance of creating an innovative experience across the personal computing continuum – from PCs to smart phones to tablets and cars, as well as any number of Internet-connected consumer devices.

Emphasizing a seamless experience across operating systems, James introduced general availability of the Intel® AppUpSM center netbook app store for consumers. The Intel AppUp center includes both free and paid apps for entertainment, social networking, gaming and productivity, optimized for a netbook’s mobility and screen size. To encourage consumers to try new applications, Intel AppUp provides “try before you buy” solutions, encouraging consumers to purchase apps they otherwise might not have. The launch was also marked by the availability of Adobe* AIR applications, as well as apps from companies including Accuweather*, Barnes & Noble*, Funkitron*, Gibson Guitars*, iWin*, Kaplan*, KONAMI*, and Lifetime*.

In an effort to reach netbook owners worldwide, James announced agreements with Best Buy*, UK-based Dixons* and India-based Croma* to outfit each retailer with the Intel AppUp center – pre-installed on netbooks the stores sell, as well as available for current netbook owners to download online. Similarly, James announced plans from ASUS* to ship its version of the Intel AppUp center on netbooks, the “asus app store,” starting in October.

During her keynote, James highlighted the Intel AppUp Developer Program, designed to drive innovative applications for end users and new revenue opportunities for independent developers and software vendors with programs such as the Intel Million Dollar Development fund. Rick Vanner from The Game Creators was recognized as winner of the “Most Innovative Application” in the Intel Atom Developer Challenge for his game titled, “Goals.” James also introduced the “On Intel AppUp” ISV identifier, designed to help developers promote their applications on Intel AppUp center.

James acknowledged seamless experiences are only part of the equation. Open operating systems – such as Intel and Nokia’s* MeeGo*, hosted by the Linux Foundation – allow developers to create, invent and innovate. Pointing to contributions from industry leaders, James discussed MeeGo ecosystem momentum, highlighting a variety of MeeGo-based devices and how third-party software developments and the upcoming MeeGo Web runtime, to be released in October, will make it easier to write applications for these devices. Internet TV pioneer Amino* also joined James onstage to demonstrate how the company is taking advantage of the flexibility and openness of MeeGo to deliver an innovative MeeGo-based smart TV solution.

Davis: Smart, Connected, Transformed Experiences

Discussing the important role the Intel Atom brand plays in delivering intelligent computing to connected devices everywhere, Davis outlined the complete Intel Atom processor line and how the company is delivering solutions based on Intel® architecture beyond the PC. Davis also emphasized how Intel Atom processor-based solutions can provide the ideal platform for Internet connectivity, intelligence, and ease of design with customer port of choice.

During his keynote, Davis launched “Tunnel Creek,” a new Intel® Atom™ E600 SoC processor series developed specifically for embedded applications such as in-vehicle infotainment systems for cars, smart grid devices and IP media phones. The SoC integrates additional capabilities onto the chip and features an open interconnect for added flexibility. Making it easier to design and customize with these new products, Vendors including OKI Semiconductor*, Realtek Semiconductor* and STMicroelectronics* will offer interconnect chipsets, and other companion silicon offerings from Dialog Semiconductor*and ROHM Co.* will regulate voltages and synchronize clocks, according to Davis.

Davis went on to unveil details of an upcoming new configurable Atom processor, codenamed “Stellarton.” The processor consists of the Atom E600 processor paired with an Altera* FPGA on a multi-chip package; which provides additional flexibility for customers who want to incorporate proprietary I/O or acceleration and enabling developers to differentiate their designs by reacting quickly to changing requirements.

Davis also introduced the Intel® Atom™ processor CE4200, formerly codenamed “Groveland,” which is designed to help seamlessly integrate the Internet experience with TV.

The SoC includes 3-D support, H.264 high-definition encoding capability for usage models such as “sync-and-go” between networked consumer electronics and portable devices, and multiple input stream support to enable the design of cost-effective home gateway appliances. To help address regulatory requirements, the SoC features smart power management capabilities that automatically help to turn off parts of the chip when not in use. A software development kit and familiar tools for integrating applications is also available which OEMs can re-use across products, cutting development time. Davis announced ADB*, Samsung*, Sagemcom* and Technicolor* plan to build set-top boxes based on the new SoC.

Microsoft*, Dell* and Visteon* joined Davis on stage during his keynote. Microsoft announced they have ported Windows* Embedded Standard 7 and Windows Media Center on Intel architecture and demonstrated prototype devices from Acer* and ASUS. Dell previewed their upcoming Intel Atom processor-based Dell convertible mobile device, expected to be available later this year. Visteon demonstrated the use of the E600 series processor in a next-generation automotive infotainment platform. Davis also highlighted mobility products based on the upcoming Intel SoC, codenamed “Oak Trail.” Touting Intel’s port of choice message, mobile device demonstrations included an ExoPC* running Microsoft Windows Embedded Standard 7, a WeTab* running MeeGo* and a Cisco Cius* running Android*.

Updated with video after the cut

As for the Intel hardware running the show, it’s a dual-core Atom processor.  In fact, Intel claim the DUO is the most powerful 10-inch tablet around, which is certainly an ambitious claim considering all we’re seeing from ARM chipsets.

Dell also showed a docking station which could be used to add amplified speakers to the DUO when in slate orientation.  According to Dell, the Inspiron tablet will be available later on in 2010.

Acer was running Windows Media Center Embedded on concept Revo 2 set-top box – using an Intel CE4100 processor, naturally – and the companies described the whole experience as a hybrid of a regular set-top box, a DVR and an HTPC.  It can play both internet content and broadcast media, making it potentially more flexible than Google TV.

As for general availability, Acer expect to have some sort of commercial variant of this prototype on the market in the first half of 2011.

Other partners include US retailers Best Buy and Chroma, together with UK retailers Dixons and Currys.  The Unity game development tool will also be coming to the AppUp store, opening up the potential for more intensive gaming experiences for ultraportable devices, together with the Havok SDK which developers can use to create realistic cloth and skin models.

AppUp will initially be available on Windows and MeeGo netbooks using Intel Atom CPUs, with Intel planning to extend the download store to TVs using their CE4100 SoC, smartphones and other devices.  Both paid and free apps will be on offer, and there will be trials available prior to purchase.

The box gets WiFi b/g/n, Bluetooth and gigabit ethernet, together with HDMI 1.3, composite and component video, RGB, S-Video and analog/digital audio.  There’s also USB 2.0 and a 500GB internal hard-drive.  As you’d expect from the CE4100, Freedom supports up to 1080p Full HD video with various local media and streaming formats.

Update: Video demo after the cut

Last we heard, the WeTab would be priced at €449 ($598) for the 16GB model and €569 ($757) for the 32GB model.  Unsurprisingly – considering they’re on stage at IDF – it uses Intel’s Atom N450 CPU with GMA 3150 graphics, WiFi and Bluetooth 2.1+EDR.

It does seem more than a little ironic that the only sighting of MeeGo today is in San Francisco with Intel, whereas Nokia apparently made a conscious decision not to bring it to Nokia World.  We’ve got video processing of the WeTab demo, and will add that in as soon as it’s ready.

Right now in San Francisco, DisplayLink is taking the curtain off their DL-1000 and DL-3000 single chip series. Both of these brand new chips feature things like integrated display and network connectivity, DisplayLink’s adaptive real-time compression technology (which should help with overall bandwidth, by taking full advantage of USB 3.0), and HD video support.

We can thank the newest version of USB for giving us simultaneous support for HD video, networking data, and HD grahics. But, as press releases tend to go sometimes, there’s no details about actual market release, let alone a price at this point. But, considering the plan on releasing it before the end of the year, hopefully we get some kind of news pertaining to those very important aspects soon. Full press release is below for your reading pleasure.

Press Release

DisplayLink SuperSpeed USB 3.0 Chip Platform Takes Major Step Toward Any Device, Any Display Connectivity

Interactive Channel of Graphics, Video and Audio to Drive Development of a New Class of Entertainment and Business PC Devices
Intel Developer Forum San Francisco 2010

PALO ALTO, Calif.–(BUSINESS WIRE)–DisplayLink Corp., the market share leader with more than three million USB graphics users worldwide, today provided a glimpse at its new SuperSpeed USB (USB 3.0) chip platform for next generation displays, docking stations and other integrated devices to be showcased next week at the Intel Developer Forum in San Francisco, California, in booth #948.

“DisplayLink is stepping to the forefront of SuperSpeed USB technology, enabling OEMs to offer state-of-the-art products that are capable of transmitting a vast amount of data very quickly”

The new DisplayLink single-chip family, DL-3000 and DL-1000 series, includes integrated display and networking connectivity, high performance audio and HD video support, as well as third generation DisplayLink adaptive real-time compression technology that dynamically manages bandwidth, taking full advantage bi-directional throughput of SuperSpeed USB. This means multiple full HD videos, high resolution graphics and networking data can be processed simultaneously, while also substantially increasing today’s HighSpeed USB (USB 2.0) graphics performance and enabling graphics delivery over gigabit Ethernet.

This new platform will enable a wide range of applications that create an interactive connection between device and display. These include:

* USB or Ethernet bus powered monitors
* Universal USB docking stations with graphics, networking, and audio
* Affordable Ethernet and USB zero clients for shared resource computing
* USB to HDMI adapters for PC to TV connectivity
* USB to DVI, VGA or DisplayPort adapters for multi-display notebooks
* Mobile device to display
* Dual-Headed USB bus powered graphics adapters

“DisplayLink technology has enabled the new category of universal docking stations, in addition to zero clients and other devices that are used by major corporations and educational institutions globally,” added Dennis Crespo, executive vice president of marketing and business development at DisplayLink. “We look forward to working with our customers to develop a host of next-generation, creative devices that solve real world problems for the digital consumer.”

SuperSpeed USB is capable of running up to 10 times faster than the previous generation of the technology transferring data at speeds of up to 5Gbps.

“DisplayLink is stepping to the forefront of SuperSpeed USB technology, enabling OEMs to offer state-of-the-art products that are capable of transmitting a vast amount of data very quickly,” said Jeff Ravencraft, president and chairman, USB-IF. “SuperSpeed USB enables new compelling use cases, such as blazing fast graphics, HD video and 3D gaming over the same USB bus.”

Features of the new DisplayLink chip platform for SuperSpeed USB include:

* Single IC support for up to two full HD displays
* High performance HD video, 3D gaming, and beyond HD graphics
* HDCP 2.0 for protected content playback
* Integrated multi-channel audio
* Networking for docking stations and zero clients
* Support for leading display standards – DisplayPort, VGA DAC, DVI, HDMI
* Backwards compatibility with 3+ million DisplayLink USB 2.0 graphics devices
* USB bus power capabilities for both USB 2.0 and 3.0
* Proven Windows driver support (XP, Vista, Windows 7, MultiPoint Server 2010, and Server 2003/2008)

“The prevalence of USB ports and the increased power of USB 3.0 make it well-suited as a display and docking station connector for both consumer and business markets, especially in today’s mobile environment. Ideally, standard network interfaces should be easy to incorporate into devices and able to handle multiple interactive tasks such as audio, graphics and video across a variety of displays,” said Rhoda Alexander Director of Monitor Research for iSuppli.

Products with integrated DisplayLink DL-3000 and DL-1000 technology are expected to reach the market in the first half of 2011.

Update: Video demo of the Intel WiDi tablet, motion-recognition system and more after the cut

The company’s WiDi or Wireless Display tech also got a name-check and an on-stage demonstration, with Intel showing a handheld tablet being used with WiDi to beam content onto a big-screen HDTV.  Having acquired Infineon’s wireless division, they also got a chance to namecheck the iPad among their “internet connectivity” push, while supported software environments included Linux, Google Chrome OS, Android, OS X, Windows and MeeGo.

Intel IDF 2010 demonstrations:

Finally, various demonstrations to show the potential of the 2011 Core CPUs were made, including simultaneously playing Starcraft II: Wings of Liberty on a laptop while recording an HD video, together with 3D gesture tracking with GestureTek software.  The new Core chips’ support for AVX will allow for more compute-heavy motion and facial recognition tracking, image, video and audio processing, and computational simulation and analysis.

Press Release:

Intel Innovating to Deliver Seamless Experiences Across Smart, Connected Devices

NEWS HIGHLIGHTS

Otellini described how the spread of smarter, Internet-connected devices presents engineering challenges and opportunities for the industry.
Intel is extending its chip design, manufacturing techniques and software expertise to offer more complete hardware and software platforms and related services for new market segments.
Innovative technologies and concepts demonstrate Intel’s leading computing architecture delivering a consistent, interoperable Internet experience across a range of devices.
Smart TV-enabling products to become available this Fall from D-Link*, Google*, Logitech*, Sony* and Telecom Italia*.

SAN FRANCISCO, Sept. 13, 2010 – Intel Corporation’s CEO Paul Otellini today highlighted several trends and technologies that have created a “new marketplace for pervasive computing” that poses engineering challenges that are also opportunities for the high-tech industry.
These trends include the proliferation of billions of smarter, Internet-connected devices that include PCs, phones and cars; and how individuals want to seamlessly move between devices to connect with friends, get information and be entertained. Otellini said people “will choose the device that provides the best experience for any given intended use and that no one device will win.”

Intel is positioning itself to advance – and benefit from – this transformation in the computing marketplace. The company is extending its chip design, manufacturing techniques and software expertise to offer more complete hardware and software platforms and related services that deliver energy-efficient performance, security and Internet connectivity across a large, dynamic range of devices. The company is developing products that span high performance PCs and servers to a broad range of other “smart” devices that currently or soon will connect to the Internet.

“Computing has become an indispensible part of our daily lives,” Otellini said in a tone-setting speech to open the company’s semi-annual Intel Developer Forum. “Our vision is to create a continuum of personal computing experiences that provides consistency and interoperability across all Internet-connected devices in the home, car, office or in your pocket.

“At the heart of this continuum will sit Intel technology that will make devices smarter, more powerful and more useful,” he added. “We’re changing how we develop and deliver solutions so we can deliver on this vision.”

Intel has made limited investments beyond the PC in recent years. However, it has made nearly $10 billion in acquisitions over the last year – starting with Wind River – to help the company extend its capabilities. Otellini said Intel’s recently announced, planned acquisitions of Infineon’s* Wireless Solutions Business and McAfee Inc.* will enhance the company’s ability to deliver products that offer a choice of wireless connections, and more effectively counter the increasingly sophisticated security attacks happening on a broad range of Internet-connected devices. The planned purchase of Texas Instruments’* cable modem business will add to Intel’s ability to deliver Internet services to consumer electronics devices.

Intel’s CEO also described how the benefits of Moore’s Law and Intel’s leading-edge transistor technology are being applied to different computing segments for increasingly capable and energy-efficient processors. The company’s unique High-k metal gate transistor technology enables 10 times less power leakage from generation to generation while continuing to improve performance.

“There’s tremendous innovation happening for PCs today,” Otellini said, citing several examples including the upcoming 2nd Generation Intel® Core™ processor family, Intel® Wireless Display technology, and manageability technology for business PCs. “I’m excited about Intel’s prospects for bringing its rich history of computing expertise to other markets.”

The Intel® Core™ processor, Intel® Atom™ processor and Intel software tools are playing a role transforming data centers, the Internet “cloud” and other areas that are being transformed by the proliferation of smarter, Internet-connected devices. Otellini highlighted Intel’s progress in these areas. He also demonstrated several technologies that showed Intel’s leading computing architecture delivering a consistent and interoperable Internet experience across multiple devices.

“We’re excited by how the TV industry is making a transition from having just a few Internet-based services to a truly integrated Internet experience,” Otellini said. “We call this new category smart TV, and products are beginning to take off around the world.”

Otellini showed two smart TV-enabling products powered by the Intel® Atom™ processor CE4100 and Google* TV that will come out this Fall. The Sony Internet TV and the Logitech Revue* add-in box seamlessly combine access to the Internet with the TV viewing experience through the combination of Intel processors and the Google TV Android* platform. D-Link*, Telecom Italia* and several other companies are also expected to launch Intel® Atom™ processor CE4100-based devices soon.

Intel’s success in the embedded processor area is continuing with design wins for Intel Core and Intel Atom processors in more than 30 market segments that include cars, home energy management and digital signage. There currently are more than 3,800 embedded customer engagements for the Intel® Atom™ processor.

The 32nm Sandy Bridge processors have integrated graphics cores, and use a new “ring” architecture that Intel claims allows for more intelligent cache sharing between CPU and GPU.  Turbo Boost has also been updated, while there’s dedicated media processing, stereoscopic 3D support and Advanced Vector Extension (AVX) support.

In the desktop processor range there’ll be 65W, 45W and 35W TDP Performance Optimized and Power Optimized options, together with low-power versions including performance- optimized 65W chips and 45W/35W power-optimized chips.  Intel will be offering these low-power processors with a new, low-profile fan heat sink, as well as with a Mini-ITX desktop board for all-in-one system builders.

Press Release:

Intel Details 2011 Processor Features, Offers Stunning Visuals Built-in

NEWS HIGHLIGHTS

Intel detailed several new and improved features for its upcoming 2nd Generation Intel® Core™ processor family for laptops and PCs. This will be Intel’s latest processor, with a rich visual experience built-in.
Expected to be in production later this year with new laptops and PCs available starting in early 2011.
Chips will further expand Intel’s battery life and performance leadership.
First public demonstrations of Intel’s next-generation Xeon™ server platforms, for both dual and multi-processing servers.

SAN FRANCISCO, Sept. 13, 2010 – Intel Corporation revealed today several significant design features for the company’s 2011 2nd Generation Intel® Core™ processor family at the Intel Developer Forum. The new and enhanced features will further extend Intel’s chip performance and battery life leadership, and add a number of visually related features built right into the chips.

Codenamed “Sandy Bridge,” the chips will be based on Intel’s first new “visibly smart” microarchitecture produced on the company’s cutting-edge manufacturing factories, or “fabs,” at 32-nanometer (nm is a billionth of a meter) process technology with second- generation high-k metal gate transistors.

“The way people and businesses are using computers is evolving at an explosive rate, fueling demand for an even more powerful and visually appealing experience,” said Dadi Perlmutter, executive vice president and general manager of the Intel Architecture Group. “Our upcoming 2nd Generation Intel Core processor family represents the biggest advance in computing performance and capabilities over any previous generation. In addition to offering these features inside Intel-based laptops, we plan to scale these advances across our server data center and embedded computing product portfolio.”

The processor family will include a new “ring” architecture that allows the built-in processor graphics engine to share resources such as cache, or a memory reservoir, with the processor’s core to increase a device’s computing and graphics performance while maintaining energy efficiency.

The 2nd Generation Intel Core processor also includes an enhanced version of Intel® Turbo Boost Technology. This feature automatically shifts or reallocates processor cores and processor graphics resources to accelerate performance, tailoring a workload to give users an immediate performance boost when needed.

Laptops and PCs powered by the 2nd Generation Intel Core processor family are expected to be available early next year.

New Visual Experience – Visibly Smart
Intel’s new processor graphics delivers enhanced visual features focused on the areas where most users are computing today: HD video, 3-D, mainstream gaming, multi-tasking and online socializing and multimedia.

To obtain and view video faster, Perlmutter demonstrated hardware accelerated video editing using the architecture’s dedicated silicon for media processing, which allows users to quickly convert video to other formats.

The 2011 chips also come with Intel Advanced Vector Extensions (AVX). AVX delivers improved performance, rich functionality and the ability to better manage, rearrange and sort data. A new 256-bit instruction set accelerates floating point intensive applications such as digital photo editing and content creation.

Intel also demonstrated a dual processor, next-generation Intel® Xeon® processor server running Vidyo* video conferencing software that utilizes the 32 threads available on the system, and takes advantage of the AES New Instructions set (AESNI). Next-generation Xeon™ processors for 2 socket servers and workstations run 8 cores and 16 threads per processor and are on schedule for production in the second half of 2011.

For more information on the Intel Developer Forum 2010, visit the press kit at www.intel.com/newsroom/idf