QUALCOMM Technologies has announced the first 4G LTE Advanced embedded connectivity platform for mobile computing devices at MWC 2013. The new platform will be used in thin form factor laptops, tablets, and convertible notebooks and is based on chipsets in the Gobi platform. QUALCOMM says that the new platform is based on the MDM9225 and MDM9625 chipsets.
The new platform is the first embedded, mobile computing solution supporting LTE carrier aggregation and LTE Category 4 with peak data rates of up to 150 Mbps. The unveiling of the new platform marks the arrival of the company’s third-generation 4G LTE embedded chips. QUALCOMM says that its new chipset platform will enable thinner, lighter, and better connected mobile computing devices running a range of operating systems including Android, Windows 8, Windows RT, and iOS.
The new platform also supports a variety of modules for thin form factors including PCI Express Mini Card, PCI Express M.2, and LGA. The Gobi MDM9x25 embedded platform also features an integrated GPS receiver supporting GLONASS. QUALCOMM says that the chipset begin sampling to module vendors late last year.
Commercial device launches using the chipset will begin in the second half of this year. The new platform will be used by Fujitsu, Lenovo, Panasonic, Huawei, Novatel Wireless, and others. Support for multiple LTE frequencies and one ship is a good thing for consumers because it means you can travel and still have access to fast connectivity just about anywhere you go.