Intel announced on Monday that it will begin shipping the XMM 6260 platform to key partners. The plaform supports HSPA+ networks with download speeds up to 21Mbps and upload speeds up to 11.5Mbps. The platform is said to use less power than competitor’s products (especially ARM). XMM 6260 is built with the 40nm manufacturing process, and is based on the X-GOLD 626 baseband processor and the SMARTi UE2 RF transceiver.
The platform was earlier tied to a MeeGo-powered handset, and can also be used in USB modems, according to Intel.
Intel also announced the multimode XMM 7060 platform will support 2G, 3G, and LTE networks. The platform is paired with the X-GOLD 706 multimode baseband processor and the SMARTi 4G multimode RF transceiver. The modem with be capable of serving up to five LTE bands, five 3G bands, and four 2G bands at the same time. Samples of the chip will ship this summer, and volume shipments will arrive during the second half of 2012.
Both will be exhibited at MWC in Spain, probably in a handset with the Medfield processor. SlashGear is covering MWC live, and will bring you more details as they become available.