SlashGear

According to DRAMeXchange, Intel’s next generation mobile platform called Santa Rosa will ship in first half of May. The new platform will uses 965 Express series chipset (Crestline) and equipped with 802.11 a/b/g/n (Intel Wi-Fi Link 4965AGN Kedron wireless module).

Santa Rosa optional features include Intel Turbo Memory (Robson), WWAN and WiMAX (Echo Peak) modules. If everything follows the timetable, ODMs will be focusing the shipments of full system and barebone notebooks by the end April.

Santa Rosa platform to hit shelves in 1H May, says DRAMeXchange [ via digitimes]